Sony MZ-NH1 User Manual Page 24

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MZ-NH1
2424
MZ-NH1
Note For Printed Wiring Boards and Schematic Diagrams
Main board is multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in this diagrams.
Lead Layouts
Note on Schematic Diagram:
All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
All resistors are in and
1
/
4
W or less unless otherwise
specified.
f : internal component.
C : panel designation.
A : B+ Line.
Total current is measured with MD installed.
Power voltage is dc 6 V and fed with regulated dc power
supply from CL451 (DC IN 6V) and CL460 (VBUS GND).
Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
(): PLAYBACK (servo on)
[]: PLAYBACK (servo stop)
: Impossible to measure
Voltages are taken with a VOM (Input impedance 10 M).
Voltage variations may be noted due to normal produc-
tion tolerances.
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
Circled numbers refer to waveforms.
Signal path.
E : PLAYBACK
j : REC
J : OPTICAL IN
F : LINE IN
d : USB input from PC
G : USB output to PC
N : MIC IN
Abbreviation
E18 : 100V - 240V AC area in E model
JE : Tourist model
Note on Printed Wiring Board:
X : parts extracted from the component side.
Y : parts extracted from the conductor side.
f : internal component.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
surfac
e
Lead layout of conventional IC CSP (chip size package)
Waveforms
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
7.6 ms
2.2 Vp-p
11.3
µ
s
2.5 Vp-p
190 mVp-p
1.2 Vp-p
Approx.
60 mVp-p
Approx.
350 mVp-p
88 ns
3 Vp-p
5.7
µ
s
2.7 Vp-p
354 ns
2.6 Vp-p
88 ns
2.9 Vp-p
22.8
µ
s
2.6 Vp-p
30.8
µ
s
960 mVp-p
44 ns
2.7 Vp-p
1
IC701 1 (VI1), 2 (WI1),
th (UI1) (Servo on)
1 V/DIV, 5 ms/DIV
7
IC501 wh (CLK) (Servo on)
1 V/DIV, 50 ns/DIV
2
IC701 tg (PWM1) (Servo on)
1 V/DIV, 5
µ
s/DIV
8
IC901 yd (CLK)
1 V/DIV, 5
µ
s/DIV
3
IC501 1 (IX) (Servo on)
50 mV/DIV, 200 ns/DIV
9
IC301 8 (BCLK)
1 V/DIV, 200 ns/DIV
4
501 8 (RFO) (Servo on)
500 mV/DIV, 200 ns/DIV
q;
IC301 9 (MCLK)
1 V/DIV, 50 ns/DIV
5
IC501 ra (FE) (Servo on)
20 mV/DIV, 1
µ
s/DIV
qa
IC301 q; (LRCK)
1 V/DIV, 10
µ
s/DIV
6
IC501 rs (TE) (Servo on)
100 mV/DIV, 1
µ
s/DIV
qs
IC871 8 (OSCOUT)
500 mV/DIV, 50
µ
s/DIV
qd
IC801 <czz (OSCO)
1 V/DIV, 20 ns/DIV
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