Sony MDS-SD1 User Manual

– 1 –MICROFILMMDS-SD1SPECIFICATIONSSERVICE MANUALMINIDISC DECKModel Name Using Similar Mechanism MDS-JE520MD Mechanism Type MDM-5ABase Unit Type MBU-5

– 10 –CLEANING OF OBJECTIVE LENS OF OPTICAL PICKUP• When cleaning the objective lens of the optical pickup, move the mechanism deck using the followin

– 11 –ATTACHING THE GLASS ASSEMBLY• Attach according to steps 1 to 4.112(Bottom side)3 Bracket (shaft)4 Screw (PTP2.6x6)When fixing this part, secure

– 12 –SERVICING POSITION1 Remove the four screws securing the upper cover, and remove the upper cover.2 Undo the bound cables.3 Remove the two screws

– 13 –RETRY CAUSE DISPLAY MODE• In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tub

– 14 –HexadecimalBitBinaryHigher Bits Lower Bits84218421b7 b6 b5 b4 b3 b2 b1 b00000000100000010000001000000100000010000001000000100000010000000Hexa-de

– 15 –Location of Parts and Controls1 1/u (Power) button2 MD disk compartment3 § button4 CLEAR button5 ENTER/YES button6 VOLUME knob7 MENU/NO button8

– 16 –SECTION 3DISASSEMBLYNote: Follow the disassembly procedure in the numerical order given.3-1. GLASS ASSY3-2. FRONT PANEL443(Bottom side)2 Bracket

– 17 –3-4. BASE UNIT AND BD BOARD3-3. SLIDER (CAM)1 Two screws (BTP2.6x6)2 Bracket (Guide L)3 Leaf spring5 Bracket (Guide R)6 Slider (Cam)4 Two screws

– 18 –3-5. SW BOARD AND LOADING MOTOR (M103)5 Two screws (BTP2.6x6)6 SW board4 Loading motor (M103)3 Two screws (PWH1.7x4)1 Screw (PTPWH M2.6x6)2 G

– 19 –SECTION 4TEST MODE4-1. PRECAUTIONS FOR USE OF TEST MODE• As loading related operations will be performed regardless of the test mode operations

– 2 –SELF-DIAGNOSIS FUNCTIONThe self-diagnosis function consists of error codes for customers which are displayed automatically when errors occur, and

– 20 –4-5. SELECTING THE TEST MODEThere are 31 types of test modes as shown below. The groups can be switched by rotating the – ˜ + knob. After sele

– 21 –“CPLAY MID” n “CPLAY OUT” n “CPLAY IN” “CPLAY MID” n “CPLAY OUT” n “CPLAY IN” 4-5-1. Operating the Continuous Playback Mode1. Entering the con

– 22 –PSYNCLEVEL-SYNCOVERREPEAT1TRACKDISCDATEMONOWhen OffContentsDisplayWhen LitDuring continuous playback (CLV: ON)Tracking servo OFFCLV low speed mo

– 23 –5-1. PARTS REPLACEMENT AND ADJUSTMENT• Check and adjust the MDM and MBU as follows.The procedure changes according to the part replacedSECTION

– 24 –5-2. PRECAUTIONS FOR CHECKING LASER DIODEEMISSINONTo check the emission of the laser diode during adjustments, neverview directly from the top a

– 25 –5-6. CHECKS PRIOR TO REPAIRSThese checks are performed before replacing parts according to“approximate specifications” to determine the faulty l

– 26 –10. Observe the waveform of the oscilloscope, and check that thespecified value is satisfied. Do not rotate the – ˜ + knob.(Traverse Waveform)

– 27 –5-7. INITIAL SETTING OF ADJUSTMENT VALUENote:Mode which sets the adjustment results recorded in the non-volatilememory to the initial setting va

– 28 –KMS260A27X40B0825NIop = 82.5 mA in this caseIop (mA) = Digital voltmeter reading (mV)/1 (Ω)7. Then, rotate the – ˜ + knob and display “LDPWR C

– 29 –11. Rotate the – ˜ + knob until the waveform of the oscillo-scope moves closer to the specified value.In this adjustment, waveform varies at i

– 3 –ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTSSelecting the Test ModeDisplaytotal rectotal playretry errtotal errerr historyer refreshtm refreshD

– 30 –5-13. ERROR RATE CHECK5-13-1. CD Error Rate CheckChecking Procedure :1. Load a check disc (MD) TDYS-1.2. Rotate the – ˜ + knob and display “CP

– 31 –NOTE:It is useful to use the jig. for checking the waveform.(Refer to Servicing Note on page 6.)5-15. ADJUSTING POINTS AND CONNECTING POINTS[BD

– 32 –SECTION 6DIAGRAMS6-1. CIRCUIT BOARDS LOCATIONMAIN boardSW boardPANEL boardPANEL SW boardENCODER boardBD boardCONNECTOR board

MDS-SD1– 33 –– 34 –6-2. BLOCK DIAGRAMS– BD SECTION –HR901OVER WRITEHEADHEADDRIVEQ181,1823612FILTERPCOFILIFILOCLTVPLLEFM,ACIRC,ENCODER/DECODERRF AGC &a

MDS-SD1– 35 –– 36 –– MAIN SECTION –1277372171618121946226814132415807975788281353736586366535159577460546567885655778769221214910019452915134443133012

MDS-SD1– 37 – – 38 –WAVEFORMS– BD (1/2) SECTION –– MAIN SECTION –THIS NOTE IS COMMON FOR PRINTED WIRINGBOARDS AND SCHEMATIC DIAGRAMS.(In addition to t

MDS-SD16-3. PRINTED WIRING BOARD – BD SECTION –• See page 32 for Circuit Boards Location.– 39 –– 40 –D101 A-1D181 D-3D183 D-3IC103 B-1IC123 D-2IC171 D

MDS-SD1– 41 – – 42 –6-4. SCHEMATIC DIAGRAM – BD (1/2) SECTION –• See page 38 for Waveforms.• See page 61 for IC Block Diagrams.• See page 64 for IC Pi

MDS-SD1– 43 –– 44 –6-5. SCHEMATIC DIAGRAM – BD (2/2) SECTION –• See page 38 for Waveforms.• See page 39 for Printed Wiring Board.(Page 41)(Page 41)(Pa

MDS-SD1– 45 – – 46 –6-6. SCHEMATIC DIAGRAM – MAIN (1/2) SECTION –• See page 38 for Waveforms.• See page 49 for Printed Wiring Board.• See page 65 for

– 4 –CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardous ra-diation exposure.N

MDS-SD1– 47 –– 48 –6-7. SCHEMATIC DIAGRAM – MAIN (2/2) SECTION –• See page 38 for Waveforms.• See page 62 for IC Block Diagrams.(Page 52)(Page 45)(Pag

MDS-SD1– 49 – – 50 –• SemiconductorLocation6-8. PRINTED WIRING BOARD – MAIN SECTION –• See page 32 for Circuit Boards Location.Ref. No. LocationD172 C

MDS-SD1– 51 –– 52 –6-9. SCHEMATIC DIAGRAM – PANEL SECTION –• See page 38 for Waveforms.(Page 47)470pDTC143TKA-T146DTC144EKA-T146DTC144EKA-T146

MDS-SD1– 53 – – 54 –D941 C-7D942 C-6D943 C-3D944 C-3D945 C-4D946 C-5IC901 B-5Q921 B-3Q941 C-7Q942 C-66-10. PRINTED WIRING BOARD – PANEL SECTION –• See

MDS-SD1– 55 – – 56 –6-11. SCHEMATIC DIAGRAM – CONNECTOR SECTION –• See page 63 for IC Block Diagrams.(Page 46)

MDS-SD1– 57 –– 58 –6-12. PRINTED WIRING BOARD – CONNECTOR SECTION –• See page 32 for Circuit Boards Location.• SemiconductorLocationRef. No. LocationD

MDS-SD16-14. PRINTED WIRING BOARD – BD SWITCH SECTION –• See page 32 for Circuit Boards Location.6-13. SCHEMATIC DIAGRAM – BD SWITCH SECTION –– 59 – –

– 61 –6-17. IC BLOCK DIAGRAMS– BD Section –IC101 CXA2523AR–1–2+–IVRBB+–IVRAA+–IVRCC+–IVRDD+–IVR+–EEEE'EFB TESWPTGR48MORFO47MORFI46RFO45OPN44OPO43

– 62 –IC152 BH6511FS-E232 31 30 29 28 27 26 25 24 23 22 21 20 19 18 171 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16GNDVGIN4RIN4FVM4OUT4FPGND4OUT4RVM34OUT3RPG

– 63 –– CONNECTOR Section –IC822 M62016FP-E1IC774 P82B715TD.118+–+–3 4 5 62871VCCNCNCNCRESETGNDCDINTINTERRUPTSIGNALGENERATORRESETSIGNALGENERATORCOMR1R

– 5 –TABLE OF CONTENTS1. SERVICING NOTE ... 62. GENERAL ...

– 64 –6-18. IC PIN FUNCTIONS• IC101 CXA2523AR (RF Amplifier) (BD Board)Pin No.1 I I I-V converted RF signal I input from the optical pick-up block de

– 65 –• IC701 M30610MC-A01FP (SYSTEM CONTROL µCON) (MAIN BOARD)Pin No.Pin Name I/OFunction1 WMOUT O MD WM LINK data out2 WMCLK I MD WM LINK clock in3

– 66 –Pin No.Pin Name I/OFunction51 CHAK-IN I Detection signal from IN switch52 HOME I Detection signal form HOME switch53 PACK-OUT I Detection signal

– 67 –SECTION 7EXPLODED VIEWS7-1. CASE AND BACK PANEL SECTIONNOTE:• Items marked “*” are not stocked since they areseldom required for routine servic

– 68 –7-2. FRONT PANEL SECTIONRef. No. Part No. Description Remark Ref. No. Part No. Description Remark61 4-951-620-01 SCREW (2.6X8), +BVTP* 62 1-671-

– 69 –7-3. MECHANISM DECK SECTION (MDM-5A)Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark215 4-996-227-01 LEVER (HEAD)216 4-

– 70 –7-4. BASE UNIT SECTION (MBU-5A)Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark265 4-996-261-01 GEAR (SL-B)266 4-996-26

– 71 –• SEMICONDUCTORSIn each case, u: µ , for example:uA...: µ A..., uPA...: µ PA..., uPB...: µ PB...,uPC...: µ PC..., uPD...: µ PD...• CAPACITORSuF

– 72 –Ref. No. Part No. Description Remark Ref. No. Part No. Description RemarkBD CONNECTORL122 1-414-813-11 FERRITE 0uHL151 1-412-029-11 INDUCTOR CHI

– 73 –ENCODERRef. No. Part No. Description Remark Ref. No. Part No. Description RemarkC792 1-163-121-00 CERAMIC CHIP 150PF 5% 50V< CONNECTOR >*

– 6 –SECTION 1SERVICING NOTEJIG FOR CHECKING BD BOARD WAVEFORMThe special jig (J-2501-149-A) is useful for checking the waveform of the BD board. The

– 74 –Ref. No. Part No. Description RemarkRef. No. Part No. Description RemarkMAINC503 1-163-038-91 CERAMIC CHIP 0.1uF 25VC504 1-163-121-00 CERAMIC CH

– 75 –Ref. No. Part No. Description RemarkRef. No. Part No. Description Remark< COIL >L501 1-414-396-21 INDUCTOR 4.7uH< LINE FILTER >LF801

– 76 –The components identified by mark ! or dottedline with mark ! are critical for safety.Replace only with part number specified.Ref. No. Part No.

– 77 –Ref. No. Part No. Description RemarkACCESSORIES & PACKING MATERIALS*******************************1-543-793-11 FILTER, CLAMP (FERRITE CORE)1

– 78 –Sony CorporationHome A&V Products Company9-922-970-1198L0953-1Printed in Japan © 1998. 12Published by Quality Assurance Dept.(Shibaura)MDS-S

– 7 –IOP DATA RECORDING AND DISPLAY WHEN PICKUP AND NON-VOLATILE MEMORY (IC171 OF BD BOARD)ARE REPLACEDThe IOP value labeled on the pick-up can be rec

– 8 –• 0.9 mW powerSpecified value : 0.84 to 0.92 mW• 7.0 mW powerSpecified value : 6.8 to 7.2 mWlop (at 7mW)• Labeled on the optical pickupIop value

– 9 –FORCED RESETThe system microprocessor can be reset in the following procedure.Use these procedure when the unit cannot be operated normally due t