Sony MZ-R50 User Manual

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MICROFILM
MZ-R50
SERVICE MANUAL
PORTABLE MINIDISC RECORDER
SPECIFICATIONS
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Tourist Model
Model Name Using Similar Machanism NEW
MD Machanism Type MT-MZR-50-143
Optical Pick-up Type KMS-280A
US and foreign parts licensed Dolby Laboratories Licensing
Corporation.
System
Audio playing system
MiniDisc digital audio system
Laser diode properties
Material: GaAIAs
Wavelength: λ = 780 nm
Emission duration: continuous
Laser output: less than 44.6 µW
(This output is the value measured at a
distance of 200 mm from the lens surface on
the optical pick-up block with 7 mm
aperture.)
Recording and playback time
Maximum 74 minutes (MDW-74, stereo
recording)
Maximum 148 minutes (MDW-74, monaural
recording)
Revolutions
400 rpm to 900 rpm (CLV)
Error correction
Advanced Cross Interleave Reed Solomon
Code (ACIRC)
Sampling frequency
44.1 kHz
Sampling rate converter
Input: 32 kHz / 44.1 kHz / 48 kHz
Coding
Adaptive Transform Acoustic Coding (ATRAC)
Modulation system
EFM (Eight to Fourteen Modulation)
Number of channels
2 stereo channels
1 monaural channel
Frequency response
20 to 20,000 Hz ± 3 dB
Wow and Flutter
Below measurable limit
Inputs
Microphone: stereo mini-jack, 0.22-0.78 mV
Line in: stereo mini-jack, 69-194 mV
Optical (Digital) in: optical (digital) mini-jack
Outputs
Headphones: stereo mini-jack, maximum
output level 5 mW+ 5 mW, load impedance
16 ohm
Line out: stereo mini-jack, 194 mV, load
impedance 10 kilohm
General
Power requirements
Sony AC Power Adaptor (supplied)
connected at the DC IN 6 V jack:
120 V AC, 60 Hz (US, Canadian model)
220-230 V AC, 50/60 Hz (AEP model)
230-240 V AC, 50/60 Hz (UK, Hong Kong model)
240 V AC, 50/60 Hz (Australian model)
100-240 V AC, 50/60 Hz (E, Tourist model)
Lithium ion rechargeable battery LIP-8 (supplied)
Two LR6 (size AA) alkaline batteries (not supplied)
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Summary of Contents

Page 1 - SERVICE MANUAL

MICROFILMMZ-R50SERVICE MANUALPORTABLE MINIDISC RECORDERSPECIFICATIONSUS ModelCanadian ModelAEP ModelUK ModelE ModelAustralian ModelTourist ModelModel

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Page 6

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– 15 –

Page 8

– 16 –

Page 9

– 17 –

Page 10

– 18 –

Page 11

– 19 –

Page 12

– 2 –Specifications ... 11. SERVICING NOTE ...

Page 13

– 20 –SECTION 3DISASSEMBLYNote : Follow the disassembly procedure in the numerical order given.3-1. UPPER PANEL ASSY, BOTTOM PANEL ASSY REMOVALr The e

Page 14

– 21 –3-3. MECHANISM DECK (MT-MZR50-143) REMOVAL3-2. MAIN BOARD REMOVAL87 LCD flexible board (Main board CN803)1 Screws (M1.4 toothed lock)5 Fl

Page 15

– 22 –3-4. OPTICAL PICK-UP ASSY, REC BOARD REMOVAL3-5. CLV BOARD REMOVAL36Optical pick-up assy2 Screws (M1.4x3.0 locking)5 ScrewREC board1 OP flexib

Page 16

– 23 –3-6. BATTERY CASE ASSY REMOVAL3-7. POWER BOARD, SWITCH BOARD REMOVAL3341Battery case assyChassis (Main) assy2 Screws (M1.4 precision pan)5443

Page 17

– 24 –3-8. SWITCH UNIT (WITH JOG DIAL) REMOVAL352Switch unit(with JOG dial) Ornamental belt assy4 Screws (1.7)1 Screw (Precision)Chassis (Main) assy

Page 18

– 25 –SECTION 4TEST MODE[Operations When Test Mode is Set]When the test mode is set, the LCD will display as follows.• The LCD performs the following

Page 19

– 26 –[Servo Mode]• Set the test mode, press the + key, and set the servo modeusing the VOLUME + and – keys.• When the servo mode is set, the optical

Page 20 - DISASSEMBLY

– 27 –• Adjusting MethodNote : There is basically no display for individual adjustment items.Only such upper position titles as SERVO, AUDIO, etc.(100

Page 21 - 3-2. MAIN BOARD REMOVAL

– 28 –[Audio Mode]• Set the test mode, press the + key, and set the audio modeusing the VOLUME + and – keys.• To set other modes, refer to “Structure

Page 22 - 3-5. CLV BOARD REMOVAL

– 29 –[Mecha Mode]• Set the test mode, press the + key, and set the mecha modeusing the VOLUME + and – keys.• To set other modes, refer to “Structure

Page 23 - (M1.4 precision pan)

– 3 –SECTION 1SERVICING NOTEWhen repairing this device with the power on, if you remove the main board or open the upper panel assembly, this device s

Page 24

– 30 – * Display during MO automatic adjustment4. If the automatic adjustment results are OK, the following willbe displayed.5. If the automatic adju

Page 25 - TEST MODE

– 31 –5-4. DD 2.8V AdjustmentConnection :Adjusting Method :1. Connect the digital voltmeter to test point TP8507 (+2.8V) andTP8505 (AGND) on power boa

Page 26 - VOLUME +key or – key

– 32 –5-5. Laser Power CheckConnection :Adjusting Method :1. Set the servo mode of the test mode (Mode : 000).2. Press the ” key, and set the laser po

Page 27 - 026 4B 01

– 33 –5-7. Low Reflection CD Traverse AdjustmentConnection :Adjusting Method :1. Set the servo mode of the test mode (Mode : 000).2. Press the ” key,

Page 28 - • Structuer of Audio Mode

– 34 –Adjustment Location :CN501IC501C504C510IC503AP5500 (RF)AP574 (LDIO)AP5430 (RF)AP5117 (VCC)AP5500 (RF)AP574 (LDIO)AP5430(RF)AP5117 (VCC)SP543TP59

Page 29

– 35 –Pin No. Pin name I/O Description1 MNT 0 O Traverse count signal output.2 MNT 1 O Track jump detect output.3 MNT 2 – Not used (Open).4 MNT 3 – No

Page 30 - CD mode NG

– 36 –Pin No. Pin name I/O Description56 AVSS – Ground terminal.57 PDO – Not used (Open).58 PCO O Decoder PLL master clock PLL phase comparison output

Page 31 - ADJUSTMENTS

– 37 –Pin No. Pin name I/O Description1 CLCS O Chip select output to real time clock (IC804).2 XRST O Reset output. L : Reset3 WRPWR O Laser power swi

Page 32 - 5-6. MO Traverse Adjustment

– 38 –Pin No. Pin name I/O Description51 AVREF I A/D converter reference voltage input.52 AVDD – A/D converter power supply terminal.53 AM3 MNT I AC a

Page 33 - 5-9. CD RF Level Check

– 39 – – 40 – – 42 –– 41 – – 43 –6-2. BLOCK DIAGRAM• Signal path.E : PBa : RECN : MIC6-3. CIRCUIT BOARDS LOCATIONMZ-R50REC boardCLV boardMAIN boardPOW

Page 34 - Adjustment Location :

– 4 –SECTION 2GENERALThis section is extracted frominstruction manual.

Page 35 - DIAGRAMS

– 49 – – 50 – – 52 –– 51 –MZ-R506-5. SCHEMATIC DIAGRAM – MAIN (1/3) SECTION –r Refer to page 61 for IC Block Diagram.Note:• All capacitors are in µF u

Page 36 - SS – Ground terminal

– 55 – – 56 –– 53 – – 54 –MZ-R50r Refer to page 62 for IC Block Diagrams.6-6. SCHEMATIC DIAGRAM – MAIN (2/3) SECTION –Note:• All capacitors are in µF

Page 37 - SS – Ground

– 57 – – 58 – – 60 –– 59 –MZ-R50Note:• All capacitors are in µF unless otherwise noted. pF: µµF50 WV or less are not indicated except for electrolyti

Page 38

– 61 –MZ-R50r IC BLOCK DIAGRAMS – MAIN (1/3) SECTION –IC501 CXA2523AR-T44846

Page 39 - SWITCH board

– – 62 –IC804 DS1302ZIC806 MB3800PNFIC506 MPC18A20VMr IC BLOCK DIAGRAMS – MAIN

Page 40 - – 49 – – 50 – – 52 –– 51 –

– – 63 –IC802 RS5RJ29261IC807 AK93C45AV-L23546781OSCVSSCEVD INVD OUTEXT

Page 41 - – 55 – – 56 –– 53 – – 54 –

– – 64 –IC303 AK4515-VQr IC BLOCK DIAGRAM – MAIN (3/3) SECTION –2122242526

Page 42 - – 57 – – 58 – – 60 –– 59 –

– 65 –SECTION 7EXPLODED VIEWSNOTE :• -XX, -X mean standardized parts, so theymay have some difference from the originalone.• Color indication of Appe

Page 43 - IC501 CXA2523AR-T4

– 66 –Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark51 X-4949-116-1 CASE ASSY, BATTERY52 1-782-709-11 WIRE (FLAT TYPE) (22

Page 44 - IC506 MPC18A20VM

– 67 –101 1-667-210-11 MD FLEXIBLE BOARD102 4-963-883-01 SCREW (M1.4), PRECISION PAN103 A-3293-756-A CLV BOARD, COMPLETE104 1-667-690-11 CLV FLEXIBLE

Page 46 - IC303 AK4515-VQ

– 68 –NOTE :• Due to standardization, replacements in theparts list may be different from the partsspecified in the diagrams or the componentsused on

Page 47 - EXPLODED VIEWS

– 69 –C220 1-107-823-11 CERAMIC CHIP 0.47uF 10% 16VC221 1-109-982-11 CERAMIC CHIP 1uF 10% 10VC222 1-162-957-11 CERAMIC CHIP 220PF 5% 50VC223 1-117-919

Page 48 - 7-2. CHASSIS SECTION

– 70 –C829 1-109-982-11 CERAMIC CHIP 1uF 10% 10VC830 1-110-569-11 TANTAL. CHIP 47uF 20% 6.3VC831 1-104-852-11 TANTAL. CHIP 22uF 20% 10VC833 1-164-156-

Page 49

– 71 –Q810 8-729-905-35 TRANSISTOR 2SC4081-RQ811 8-729-927-62 TRANSISTOR UMX1Q901 8-729-042-81 TRANSISTOR FZT788BTCQ902 8-729-026-53 TRANSISTOR

Page 50 - ELECTRICAL PARTS LIST

– 72 –R802 1-216-851-11 METAL CHIP 330K 5% 1/16WR803 1-216-857-11 METAL CHIP 1M 5% 1/16WR816 1-216-851-11 METAL CHIP 330K 5% 1/16WR817 1-216-851-11 ME

Page 51

– 73 –L804 1-414-410-21 INDUCTOR 10uHL805 1-414-410-21 INDUCTOR 10uH< TRANSISTOR >Q803 8-729-807-52 TRANSISTOR 2SD1623-TQ804 8-729-822-62 TRAN

Page 52

– 74 –MZ-R509-923-258-11Sony CorporationPersonal A&V Products Company97L0290-1Printed in Japan © 1997.12Published by Quality Engineering Dept. (S

Page 53

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